Heat dissipation (thermal management) sheet type "COH series"
Excellent flexibility and adhesion allow it to conform to fine uneven surfaces! It does not create air pockets on the contact surface!
The "COH Series" is a sheet-type thermal interface material that is placed in the gaps between heating elements and cooling components such as heat sinks, effectively removing air pockets. It has a high thermal conductivity and the exceptional softness of "αGEL," which provides excellent adhesion and conformity, resulting in high heat dissipation effectiveness while reducing stress on substrates and components. Customization is available to meet specific requirements, including reinforced materials, one-sided non-adhesive options, and adhesive-backed versions. 【Features】 ■ High thermal conductivity of up to 20W/mK, demonstrating excellent heat dissipation effects ■ Excellent flexibility and adhesion allow it to conform to fine uneven surfaces, preventing air pockets at contact points ■ Superior electrical insulation and flame resistance ■ Low compressive stress reduces load on substrates and components ■ Custom die-cutting available for any shape *For more details, please refer to the related links or feel free to contact us.
- Company：タイカ
- Price：Other
